{"id":402,"date":"2023-02-27T15:04:02","date_gmt":"2023-02-27T06:04:02","guid":{"rendered":"http:\/\/133.125.84.183\/en\/products\/p1121"},"modified":"2023-08-23T21:21:06","modified_gmt":"2023-08-23T12:21:06","slug":"p1121","status":"publish","type":"products","link":"http:\/\/133.125.84.183\/en\/products\/p1121\/","title":{"rendered":"Copper Pillar(Cu Pillar) ,Copper Post(Cu Post) ,Copper Column(Cu Column)"},"content":{"rendered":"
<\/p>\n
At FINECS, we produce and sell Cu pillars with a diameter ranging from 60\u03bcm to several 100\u03bcm, perfectly suitable for mounting on next-generation 2.5D or 3D packages with small pitches.
\nOur high-precision processing technology makes use of in-house made equipment and dies, enabling processing with stable dimensional accuracy, and can handle monthly production rates from hundreds of millions up to tens of billions.<\/b><\/p>\n
\"Copper<\/figure>\n
\"Copper<\/figure>\n<\/div>\n
\n

Product features<\/h2>\n
\"Cu<\/figure>\n
\"Example
Example of Cu Pillar pin mounting<\/figcaption><\/figure>\n
\"Cu<\/figure>\n

Our Cu pillars \/ posts \/ pins are used in various ways and applications: a) in semiconductor packages with a PoP structure (package on package), as used in high-speed communication devices like smartphones or other mobile 5G devices, b) as an interconnect or interposer for a board with built-in components, c) in combination with solder balls or plating serving as a new technology to replace bumps.<\/p>\n

As the density of semiconductor chips increases, the number of terminals is also increasing. To respond to this trend, and to deal with smaller pitches, minuscule copper terminals can be affixed like pillars to substitute for conventional solder bumps used to connect the semiconductor chip and package interposer.<\/p>\n

There are two methods, using plating to create copper pillars, posts, or pins and mechanically arranging micro-terminals. At our company, we use our long years of experience manufacturing the micro-terminals to offer high-precision micro-terminals for use as Copper Pillars(Cu Pillars),Copper Column(Cu Column),Copper Chip(Cu Chip).<\/p>\n

Related products: Ultra-small pins, extra-fine pins, micro pins<\/a><\/p>\n

We use our experience in remaining the world PGA Pins (Terminals for CPUs)<\/a> market leader to attain high quality and large manufacturing capacity.<\/p>\n

Comparison of Cu pillar pins, solder balls and plating laminates<\/h2>\n\n\n\n\n\n\n
<\/th>\nCopper pillar<\/th>\nSolder ball<\/th>\nPlating laminates<\/th>\n<\/tr>\n
Height
\nPitch<\/th>\n		H:Flexible<\/b>\"Cupillar<\/p>\n

P : Narrower pitch possible than with solder ball of same size<\/span><\/td>\n

H\uff1cP possible<\/b>
\nNarrow pitch not possible
\n\"solder
\nOnly with same height(H) and pitch (P)<\/td>\n		H\uff1eP possible<\/b>
\nNarrow pitch possible
\n\"plating<\/td>\n<\/tr>\n
Connection<\/th>\nStrong<\/b>
\n(surface contact)
\n\"Copper<\/td>\n		Weak<\/b>
\n(surface contact)
\n\"solder<\/td>\n		Strong<\/b>
\n(surface contact)
\n\"plating<\/td>\n<\/tr>\n
Shape<\/th>\nChoosable<\/b>
\n(straight,T-shape,etc)
\n\"\"<\/td>\n		Ball shape only\"solder<\/b><\/td>\nCylindrical<\/b>
\n\u203bIn case of lamination only cylindrical shape
\n\"plating<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
\n